Synthetic lab-grown diamond powder for precision polishing, cutting tools, wire-saw slurries, and advanced surface finishing. 30% cost savings vs natural diamond powder with consistent quality.

Specifications

• Hardness: 10 Mohs
• Min Particle Size: 0.1 μm
• Vickers Hardness: 3500 HV
• Cost Savings vs Natural: 30%
• Morphology: Blocky monocrystalline
• Size range: 0.1–100 µm (custom grading available)

Applications

• Precision wafer polishing (CMP slurry)
• Cutting tool coatings
• Wire-saw slurries
• Optical element lapping
• Ceramic grinding