High-purity polycrystalline CVD diamond for thermal management in high-power packages, laser diodes, and RF amplifiers. 50× better thermal performance than copper at significantly lower weight.

Specifications

• Thermal Conductivity: 1800 W/m·K
• Min Thickness: 0.5 mm
• Max Operating Temp: 500°C
• Performance vs Copper: 50×
• Surface Finish: Lapped and polished
• Custom sizes available

Applications

• High-power laser diode packages
• RF power amplifier substrates
• LED thermal management
• Power module heat spreaders