🔥 Thermal Management

Diamond Heat Sinks & Spreaders

CVD polycrystalline diamond heat sinks and spreaders deliver 1200–1800 W/m·K thermal conductivity — up to 12× copper — for the world's most demanding power electronics, AI GPUs, laser diode modules, and RF amplifiers.

1800 W/m·K
Peak Thermal Conductivity
12×
vs Copper
Custom
Geometry Available
3 Weeks
Lead Time
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Technical Specifications

Complete datasheet.

Thermal Conductivity1,200 – 1,800 W/m·K
Electrical Resistivity>10¹⁰ Ω·cm (undoped)
Crystal FormPolycrystalline CVD
Surface Roughness (Ra)<50 nm (lapped) / <5 nm (polished)
Flatness<5 µm across 50 mm
Standard Dimensions5×5 mm to 50×50 mm
Thickness Range0.3 – 3.0 mm
Metallization OptionsTi/Pt/Au · TiW/Au · AuSn
Max Operating Temp700°C (in air)
Coefficient of Thermal Expansion1.0 – 1.5 ppm/K
Custom Fin GeometryYes — on request
Characterization IncludedThermal, Raman, SEM + CoA
Use Cases

Where it works best.

🤖
AI GPU & ASIC Packages
Diamond spreaders on HBM stacks and AI accelerators reduce junction-to-ambient resistance by up to 40% vs. copper IHS solutions.
⚡
Laser Diode Modules
High-brightness laser diode arrays mounted on diamond submounts achieve 3× higher CW power due to superior heat extraction from the active region.
📡
RF Power Amplifiers
GaAs and GaN power amplifiers on diamond submounts sustain 5× higher power densities than AlN alternatives, enabling smaller AESA radar panels.
🏭
Power Electronics Modules
SiC and IGBT power modules with diamond spreaders eliminate auxiliary cooling loops in EV inverters and industrial drives.
Options & Customization

Configure your order.

Size
5 × 5 mm to 50 × 50 mm
Standard rectangular blanks. Custom shapes (disc, L-shape, hex) available with 2-week additional lead time.
Thickness
0.3 mm – 3.0 mm
Standard: 0.5mm, 1.0mm, 1.5mm, 2.0mm. Tolerance ±20µm. Tighter tolerances on request.
Metallization
Ti/Pt/Au · TiW/Au · AuSn
Brazeable and solderable finishes. Single-side or double-side. Custom layer stacks available for specific bonding processes.
Surface Finish
Lapped or Mirror Polished
Lapped: Ra <50nm for standard thermal applications. Polished: Ra <5nm for direct-bond or epitaxial growth applications.
Quality Grade
Standard or Premium
Standard grade ≥1200 W/m·K. Premium grade ≥1600 W/m·K with Raman-verified conductivity map across full piece.
Quantity
1 Unit Minimum
Prototype: 1–5 pcs. Production: 6–500 pcs. Volume pricing available from 20+ pieces. Quote within 24 hours.
What's Included

Every piece ships
fully characterized.

No black-box materials. Every diamond heat sink or spreader from Karia ships with documented evidence of its thermal and physical properties — ready for your engineering sign-off.

✓
Certificate of Analysis (CoA) with measured thermal conductivity via laser flash method
✓
Raman spectroscopy report confirming sp³ carbon content and stress state
✓
Dimensional report with thickness map and flatness measurement
✓
SEM surface image (1000× and 5000× magnification)
✓
Metallization report (if applicable) with adhesion test data
✓
Direct engineering access — email tech@ for spec questions post-delivery
Also From Karia

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